SanDisk Corporation MD3331-D64-V3-X-P

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

69

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SANDISK CORP

Part Package Code

BGA

Package Description

LFBGA,

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.7 V

Supply Voltage-Nom

3.3 V

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.31.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

69

JESD-30 Code

R-PBGA-B69

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

uPs/uCs/Peripheral ICs Type

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

Seated Height-Max

1.5 mm

External Data Bus Width

16

Host Data Transfer Rate-Max

20 MBps

Host Interface Standard

ISA

Length

12 mm

Width

9 mm