TSM-113-04-L-DV-TR

Samtec, Inc. TSM-113-04-L-DV-TR

Part No:

TSM-113-04-L-DV-TR

Manufacturer:

Samtec, Inc.

Datasheet:

-

Package:

-

AINNX NO:

31929887-TSM-113-04-L-DV-TR

Description:

Products specifications
  • ECCN (US)
    EAR99
  • HTS
    8536.69.40.40
  • Automotive
    No
  • PPAP
    No
  • Termination Method
    Solder
  • Terminal Pitch (mm)
    2.54
  • Body Orientation
    Straight
  • Row Spacing (mm)
    2.54
  • Maximum Current Rating (A)
    4.1/Contact
  • Maximum Voltage Rating
    495VAC
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Product Depth (mm)
    7.36
  • Mounting
    Surface Mount
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Unshrouded Header
  • Number of Rows
    2
  • Gender
    HDR
  • Number of Contacts
    26
  • Product Length (mm)
    33.02
  • Product Height (mm)
    6.86
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