PES-08-01-T-RA-SD

Samtec, Inc. PES-08-01-T-RA-SD

Part No:

PES-08-01-T-RA-SD

Manufacturer:

Samtec, Inc.

Datasheet:

-

Package:

-

AINNX NO:

31124763-PES-08-01-T-RA-SD

Description:

Power to the Board .250 PowerStrip/40 A High-Power Socket Strip

Products specifications
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • RoHS
    Details
  • Tradename
    PowerStrip
  • Factory Pack QuantityFactory Pack Quantity
    18
  • Body Orientation
    Right Angle
  • Termination Method
    Solder
  • Base/Housing Material
    LCP (Liquid Crystal Polymer)
  • Contact Materials
    Copper Alloy
  • Mounting
    Through Hole
  • Series
    PES
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55 to 105 °C
  • Gender
    Receptacle
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Product Length
    67.31 mm
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