Samtec, Inc. MODM-D-02-8P8C-U-S4-G-Y

Shell Material

Copper Alloy

Number of Terminals

24

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8536.69.40.40

Automotive

No

PPAP

No

Number of Loaded Positions

16

Category Number

Cat 3

Termination Method

Solder

Terminal Pitch (mm)

1.27

Body Orientation

Right Angle

Maximum Current Rating (A)

1.5/Contact

Maximum Voltage Rating

120VAC

Maximum Contact Resistance (mOhm)

20

Left/Right LED Color

Green/Yellow

Mating Cycle (Cycles)

500

Integrated Magnetics

No

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

90

Product Style

Stacked

Product Depth (mm)

28.15

Spring Option

Yes

Mounting

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

RJ-45

Gender

F

Shielding

Yes

Number of Contacts

16

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

2

Tab Direction

Up/Down

Shell Plating

the outer-most structure on the hull of a steel or aluminum ship or boat.

Nickel

Product Length (mm)

16.51

Product Height (mm)

25.4