Samtec, Inc. MECT-115-01-SM-D-RA1-TR

Factory Lead Time

8 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Mounting Type

BOARD

Housing Material

Liquid Crystal Polymer (LCP)

Mounting Option 1

LOCKING

Board Mounting Option

PEG

Mounting Styles

Mounting Peg

Contact Materials

Phosphor Bronze

Factory Pack QuantityFactory Pack Quantity

500

Contact Finish Mating

GOLD

Body Length

0.591 inch

Insulator Material

LIQUID CRYSTAL POLYMER (LCP)

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

Yes

Manufacturer Part Number

MECT-115-01-SM-D-RA1-TR

Number of Rows Loaded

2

Part Life Cycle Code

Active

Ihs Manufacturer

SAMTEC INC

Number Of Connectors

ONE

Risk Rank

5.76

Manufacturer Series

MECT

Series

MECT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

JESD-609 Code

e3

Connector Type

CARD EDGE CONNECTOR

Number of Positions

30 Position

Number of Rows

2 Row

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Pitch

0.8 mm

Total Number of Contacts

30

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Reference Standard

UL

Reliability

COMMERCIAL

Number Of PCB Rows

2

PCB Contact Pattern

STAGGERED

Body Breadth

0.205 inch

Contact Gender

FEMALE

Body Depth

0.291 inch

Rated Current (Signal)

2 A

Contact Style

BELLOWED TYPE

Mating Contact Pitch

0.031 inch

Termination Type

SURFACE MOUNT

PCB Contact Row Spacing

8.2042 mm

Contact Finish Termination

MATTE TIN

Contact Pattern

STAGGERED

Insulator Color

BLACK

Product

Sockets

Mounting Angle

Right Angle