Samtec, Inc. HSEC8-109-01-S-DV-A-L2-K

Factory Lead Time

3 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Housing Material

Liquid Crystal Polymer (LCP)

RoHS

Details

Mounting Styles

Mounting Peg

Contact Materials

Beryllium Copper

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 125 C

Minimum Operating Temperature

- 55 C

Factory Pack QuantityFactory Pack Quantity

55

Tradename

Edge Rate

Rohs Code

Yes

Manufacturer Part Number

HSEC8-109-01-S-DV-A-L2-K

Part Life Cycle Code

Active

Ihs Manufacturer

SAMTEC INC

Risk Rank

5.77

Series

HSEC8

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

JESD-609 Code

e3

Connector Type

CARD EDGE CONNECTOR

Number of Positions

18 Position

Number of Rows

2 Row

Pitch

0.8 mm

Reach Compliance Code

unknown

Contact Finish Termination

Tin (Sn) - with Nickel (Ni) barrier

Product

Sockets