Samtec, Inc. EBTF-6-12-2.0-S-RA-1-T

ECCN (US)

EAR99

Automotive

No

PPAP

No

Termination Method

Press Fit

Terminal Pitch (mm)

2

Body Orientation

Right Angle

Maximum Current Rating (A)

4.2/Contact

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

85

Product Depth (mm)

35.6

Mounting

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Backplane

Gender

HDR

Number of Contacts

144

Product Length (mm)

23.9

Product Height (mm)

25.1