Samtec ACR-16-06-G-16.00-S-S1-M-1

Mounting Type

Through Hole

Mated Stacking Heights

--

Series

KX24

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Connector Type

Receptacle, Center Strip Contacts

Number of Positions

180

Number of Rows

2

Pitch

0.031 (0.80mm)

Contact Finish

Gold

Features

Board Lock

Contact Finish Thickness

3.90µin (0.099µm)

Height Above Board

0.410 (10.41mm)