Samsung Semiconductor, Inc. SPHBL1L3DH00L4A4B0

Mounting Type

Surface Mount

Package / Case

-

Supplier Device Package

-

Thermal Resistance of Package

-

Mfr

Samsung Semiconductor, Inc.

Product Status

Active

Luminous Flux @ Current/Temperature

-

Base Product Number

SPHBL1

Lens Dimensions

3.5X3.5X1.35(mm)

Mounting Orientation

TOP MOUNT

Operating Temperature Classification

Industrial

Package Type

CASE 3535

Emitting Color

Blue

Product Depth (mm)

3.5(mm)

Dominant Wave Length

454(nm)

Maximum Forward Current

1000(mA)

Operating Temp Range

-40C to 105C

Number of Elements

1

High Brightness

Yes

Rad Hardened

No

Shape Type

Square

Test Current (It)

350(mA)

Mounting

Surface Mount

Main Category

Chip LED

Series

LH351H

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Size / Dimension

0.138" L x 0.138" W (3.50mm x 3.50mm)

Type

Uni-Color

Color

Blue

Pin Count

a count of all of the component leads (or pins)

2

Voltage - Forward (Vf) (Typ)

2.86V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

130°

Forward Current

Current which flows upon application of forward voltage.

1000(mA)

Current - Test

350mA

Lumens/Watt @ Current - Test

-

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

2.86(V)

Current - Max

1A

Luminous Flux

the measure of the perceived power of light.

1.1(MAX)LM

Reverse Voltage

the voltage drop across the diode if the voltage at the cathode is more positive than the voltage at the anode

15(MAX)(V)

Wavelength

454nm

Peak Wavelength

450(nm)

Product Length (mm)

3.5(mm)

Height Seated (Max)

0.078" (1.98mm)