Samsung Semiconductor KMDP6001DA-B425

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

254

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA-254

Number of Words

68719476736 words

Number of Words Code

64000000000

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x9

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

DRAM IS ORGANISED AS 32G X 1

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B254

Organization

64GX8

Memory Width

8

Memory Density

549755813888 bit

Memory IC Type

MEMORY CIRCUIT

Profile

beryllium copper

Mixed Memory Type

FLASH+DRAM