S3C2412X26-YO80

Samsung Electronics S3C2412X26-YO80

Part No:

S3C2412X26-YO80

Manufacturer:

Samsung Electronics

Package:

-

AINNX NO:

21742795-S3C2412X26-YO80

Description:

MPU RISC 16bit/32bit 0.18um 266MHz 3.3V 272-Pin FBGA

Products specifications
  • Instruction Set Architecture
    RISC
  • Number of CPU Cores
    1
  • Data Bus Width (bit)
    32|16
  • Maximum Speed (MHz)
    266
  • Interface Type
    SPI/UART/USB
  • UART
    3
  • USART
    0
  • Multiply Accumulate
    No
  • I2C
    0
  • I2S
    0
  • Typical Operating Supply Voltage (V)
    2
  • I/O Voltage (V)
    3.3
  • Standard Package Name
    BGA
  • Supplier Package
    FBGA
  • Mounting
    Surface Mount
  • PCB changed
    272
  • Lead Shape
    Ball
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    272
  • Ethernet
    0
  • USB
    2
  • SPI
    2
  • Device Core

    Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

    ARM920T
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Supplier Unconfirmed
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