Samsung Electro-Mechanics KLMBG8FE3B-A0010

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

169

Manufacturer Part Number

KLMBG8FE3B-A0010

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

TFBGA,

Risk Rank

5.83

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltage-Max

1.95 V

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.7 V

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES AT 2.7 V MIN

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B169

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

uPs/uCs/Peripheral ICs Type

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

Seated Height-Max

1.2 mm

External Data Bus Width

8

Host Data Transfer Rate-Max

44 MBps

Host Interface Standard

USB

Width

12 mm

Length

16 mm