Samsung IRFS740

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

Package Description

FLANGE MOUNT, R-PSFM-T3

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

150 °C

Manufacturer Part Number

IRFS740

Turn-on Time-Max (ton)

62 ns

Package Shape

RECTANGULAR

Manufacturer

Samsung Semiconductor

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Turn-off Time-Max (toff)

111 ns

Risk Rank

5.71

Part Package Code

SFM

Drain Current-Max (ID)

5.4 A

Subcategory

FET General Purpose Power

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

ISOLATED

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-220AB

Drain Current-Max (Abs) (ID)

5.5 A

Drain-source On Resistance-Max

0.55 Ω

Pulsed Drain Current-Max (IDM)

40 A

DS Breakdown Voltage-Min

400 V

Avalanche Energy Rating (Eas)

157 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

40 W

Power Dissipation Ambient-Max

40 W