RUM001L02T2CL

ROHM Semiconductor RUM001L02T2CL

Part No:

RUM001L02T2CL

Manufacturer:

ROHM Semiconductor

Package:

SOT-723

ROHS:

AINNX NO:

6384137-RUM001L02T2CL

Description:

MOSFET N-CH 20V 0.1A VMT3

Products specifications
  • Factory Lead Time
    16 Weeks
  • Package / Case
    SOT-723
  • Mounting Type
    Surface Mount
  • Mount
    Surface Mount
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Number of Pins
    3
  • Transistor Element Material
    SILICON
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    20 ns
  • Power Dissipation (Max)
    150mW Ta
  • Number of Elements
    1
  • Drive Voltage (Max Rds On, Min Rds On)
    1.2V 4.5V
  • Current - Continuous Drain (Id) @ 25℃
    100mA Ta
  • Published
    2012
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    150°C TJ
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • ECCN Code
    EAR99
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    FLAT
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Configuration
    SINGLE WITH BUILT-IN DIODE AND RESISTOR
  • Number of Channels
    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    150mW
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    5 ns
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    3.5 Ω @ 100mA, 4.5V
  • Vgs(th) (Max) @ Id
    1V @ 100μA
  • Input Capacitance (Ciss) (Max) @ Vds
    7.1pF @ 10V
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    4ns
  • Vgs (Max)
    ±8V
  • Fall Time (Typ)
    38 ns
  • Continuous Drain Current (ID)
    100mA
  • Gate to Source Voltage (Vgs)
    8V
  • Drain-source On Resistance-Max
    4.2Ohm
  • Drain to Source Breakdown Voltage
    20V
  • Max Junction Temperature (Tj)
    150°C
  • Height
    550μm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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