BD11670GWL-E2

ROHM Semiconductor BD11670GWL-E2

Part No:

BD11670GWL-E2

Manufacturer:

ROHM Semiconductor

Datasheet:

BD11670GWL

Package:

11-UFBGA, CSPBGA

ROHS:

AINNX NO:

6326487-BD11670GWL-E2

Description:

DPDT TYPE (DOUBLE POLE DOUBLE TH

Products specifications
  • Factory Lead Time
    11 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    11-UFBGA, CSPBGA
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Applications
    USB
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of Channels
    2
  • On-State Resistance (Max)
    5Ohm Typ
  • Switch Circuit

    establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

    DPDT
  • Voltage - Supply, Single (V+)
    3V~5.5V
  • Features
    USB 2.0
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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