2SC4098T106P

ROHM Semiconductor 2SC4098T106P

Part No:

2SC4098T106P

Manufacturer:

ROHM Semiconductor

Datasheet:

2SC4098

Package:

SOT-323

ROHS:

AINNX NO:

6094094-2SC4098T106P

Description:

RF TRANS NPN 25V 300MHZ UMT3

Products specifications
  • Factory Lead Time
    7 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Package / Case
    SOT-323
  • Number of Pins
    3
  • Collector-Emitter Breakdown Voltage
    25V
  • Number of Elements
    1
  • hFEMin
    82
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2004
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • Termination
    SMD/SMT
  • ECCN Code
    EAR99
  • Type
    General Purpose
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150°C
  • Min Operating Temperature
    -55°C
  • Voltage - Rated DC
    25V
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    200mW
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Current Rating

    Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

    50mA
  • Frequency
    300MHz
  • Time@Peak Reflow Temperature-Max (s)
    10
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Polarity
    NPN
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    200mW
  • Transistor Application
    AMPLIFIER
  • Gain Bandwidth Product

    The gain–bandwidth product (designated as GBWP, GBW, GBP, or GB) for an amplifier is the product of the amplifier's bandwidth and the gain at which the bandwidth is measured.

    300MHz
  • Collector Emitter Voltage (VCEO)
    25V
  • Max Collector Current
    50mA
  • Transition Frequency
    300MHz
  • Max Breakdown Voltage
    25V
  • Collector Base Voltage (VCBO)
    40V
  • Emitter Base Voltage (VEBO)
    5V
  • DC Current Gain-Min (hFE)
    82
  • Continuous Collector Current
    50mA
  • Collector-Base Capacitance-Max
    2.2pF
  • REACH SVHC
    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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