Rochester Electronics LLC TMX320C6414TGLZ

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

532

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS INC

Part Package Code

BGA

Package Description

HFBGA,

Clock Frequency-Max

100 MHz

Operating Temperature-Max

90 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Supply Voltage-Max

1.24 V

Supply Voltage-Min

1.16 V

Supply Voltage-Nom

1.2 V

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO REQUIRES 3.3V SUPPLY

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

532

JESD-30 Code

S-PBGA-B532

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

uPs/uCs/Peripheral ICs Type

DIGITAL SIGNAL PROCESSOR, OTHER

Seated Height-Max

3.3 mm

Address Bus Width

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

23

Boundary Scan

YES

Low Power Mode

YES

External Data Bus Width

64

Format

FIXED POINT

Barrel Shifter

NO

Internal Bus Architecture

MULTIPLE

Length

23 mm

Width

23 mm