Rochester Electronics LLC TLV2462AIDR

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

synthetic polyolefin

Number of Terminals

8

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS INC

Part Package Code

SOIC

Package Description

SOP,

Common-mode Reject Ratio-Nom

80 dB

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Slew Rate-Nom

1.6 V/us

Supply Voltage-Nom (Vsup)

3 V

Diameter of protected wire (cable)

2.1…3.6 mm

Diameter before shrink

4.5 mm

Diameter after shrink

2.0 mm

Wall thickness before shrink

0.25 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

roll 200 m

JESD-609 Code

e4

Pbfree Code

Yes

Type

Heat shrink tube without adhesive

Terminal Finish

NICKEL PALLADIUM GOLD

Color

black

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Number of Functions

2

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDSO-G8

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

Amplifier Type

OPERATIONAL AMPLIFIER

Seated Height-Max

1.75 mm

Unity Gain BW-Nom

5200

Average Bias Current-Max (IIB)

0.075 μA

Supply Voltage Limit-Max

6 V

Input Offset Voltage-Max

1700 μV

Saturation Current

1

Length

4.9 mm

Width

3.9 mm