Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Material
aluminum alloy
Weight
not more than 0.42 g
Number of Terminals
5
Gross weight
357.14
Transport packaging size/quantity
49*27*17/70
Thread
mounting hole - М12 mm
Purpose
cooling of power semiconductor devices
Contact thermal resistance
at Vcf=0 m/s - 1.9; at Vcf=6 m/s - 6.7 (heat dissipation - 50 W) °C/W
Part Life Cycle Code
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
Part Package Code
SOIC
Package Description
GREEN, PLASTIC, SC-70, 5 PIN
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup)
1.8 V
JESD-609 Code
e0
Pbfree Code
No
Type
air pin cooler
Terminal Finish
TIN LEAD
Terminal Position
DUAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Terminal Pitch
The center distance from one pole to the next.
0.65 mm
Depth
80 mm
Reach Compliance Code
unknown
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Pin Count
a count of all of the component leads (or pins)
5
JESD-30 Code
R-PDSO-G5
Supply Voltage-Max (Vsup)
5.5 V
Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
INDUSTRIAL
Supply Voltage-Min (Vsup)
1.65 V
Number of Ports
A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.
2
Number of Bits
1
Family
LVC/LCX/Z
Output Characteristics
3-STATE
Seated Height-Max
1.1 mm
Output Polarity
INVERTED
Logic IC Type
BUS DRIVER
Propagation Delay (tpd)
8.6 ns
Saturation Current
1
Height
80 mm
Length
2 mm
Width
1.25 mm