Rochester Electronics, LLC NSR15TW1T2G

Mounting Type

Surface Mount

Package / Case

6-TSSOP, SC-88, SOT-363

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Elements

3

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

6

Terminal Finish

MATTE TIN

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

6

JESD-30 Code

R-PDSO-G6

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

50nA @ 1V

Voltage - Forward (Vf) (Max) @ If

680mV @ 10mA

Operating Temperature - Junction

-65°C~150°C

Output Current-Max

0.03A

Voltage - DC Reverse (Vr) (Max)

15V

Current - Average Rectified (Io)

30mA DC

Diode Configuration

3 Independent

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant