Rochester Electronics LLC MCIMX515DJM8C

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

529

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Part Package Code

BGA

Package Description

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529

Operating Temperature-Max

85 °C

Operating Temperature-Min

-20 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

1.15 V

Supply Voltage-Min

1.05 V

Supply Voltage-Nom

1.1 V

JESD-609 Code

e1

Pbfree Code

Yes

Terminal Finish

TIN SILVER COPPER

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

40

Pin Count

a count of all of the component leads (or pins)

529

JESD-30 Code

S-PBGA-B529

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR CIRCUIT

Seated Height-Max

1.6 mm

Saturation Current

3

Length

19 mm

Width

19 mm