Rochester Electronics, LLC MAX452CPA

Mounting Type

Through Hole

Package / Case

8-DIP (0.300, 7.62mm)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Operating Temperature (Max.)

70°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

JESD-609 Code

e0

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

Terminal Finish

TIN LEAD

Applications

Voltage Feedback

Terminal Position

DUAL

Peak Reflow Temperature (Cel)

240

Number of Functions

1

Supply Voltage

5V

Terminal Pitch

The center distance from one pole to the next.

2.54mm

Time@Peak Reflow Temperature-Max (s)

20

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDIP-T8

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Number of Circuits

1

Current - Supply

25mA

Slew Rate

the maximum rate of output voltage change per unit time.

300V/μs

Amplifier Type

OPERATIONAL AMPLIFIER

Common Mode Rejection Ratio

80 dB

Voltage - Supply, Single/Dual (±)

±4.5V~5.5V

Neg Supply Voltage-Nom (Vsup)

-5V

Unity Gain BW-Nom

50000 kHz

Current - Output / Channel

20mA

-3db Bandwidth

50MHz

Input Offset Voltage-Max

5000μV

Length

9.375mm

Height Seated (Max)

4.572mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant