Rochester Electronics, LLC FSB50325S

Mounting Type

Surface Mount

Package / Case

23-PowerSMD Module, Gull Wing

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

SPM®

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

23

Type

MOSFET

Terminal Finish

NOT SPECIFIED

Terminal Position

DUAL

Number of Functions

1

Supply Voltage

15V

Pin Count

a count of all of the component leads (or pins)

23

JESD-30 Code

R-XDMA-G23

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Voltage - Isolation

1500Vrms

Configuration

3 Phase

Voltage

250V

Current

1.5A

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant