Rochester Electronics LLC FOD817C

Material

fiberglass rod in yellow plastic sheath

Exterior Housing Material

1

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Package Description

LEAD FREE, DIP-4

Current Transfer Ratio-Nom

200%

Operating Temperature-Max

110 °C

Operating Temperature-Min

-55 °C

Purpose

for pulling cables in cable channels, boxes, pipes, etc.

Operating conditions

maximum bending radius - 30 mm

Permissible load

static tensile forces - not more than 2 kN; compressive forces - not more than 0.5 kN/cm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

in a coil

JESD-609 Code

e3

Pbfree Code

Yes

Terminal Finish

MATTE TIN

Composition

Glass-rod

Color

yellow

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

UL APPROVED

Reach Compliance Code

unknown

Configuration

SINGLE

Optoelectronic Device Type

TRANSISTOR OUTPUT OPTOCOUPLER

Forward Current-Max

0.05 A

Isolation Voltage-Max

5000 V

Dark Current-Max

100 nA

Coll-Emtr Bkdn Voltage-Min

70 V

Length

15 m

Diameter

outer diameter over the sheath - 3 mm