Mounting Type
Through Hole
Package / Case
TO-3P-3, SC-65-3
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO
Diode Element Material
SILICON
Number of Elements
2
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
Terminal Finish
MATTE TIN
Applications
ULTRA FAST SOFT RECOVERY POWER
Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
FREEWHEELING DIODE
Terminal Position
SINGLE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Reach Compliance Code
unknown
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Pin Count
a count of all of the component leads (or pins)
3
JESD-30 Code
R-PSFM-T3
Qualification Status
An indicator of formal certification of qualifications.
COMMERCIAL
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Type
Standard
Current - Reverse Leakage @ Vr
30μA @ 400V
Voltage - Forward (Vf) (Max) @ If
1.4V @ 10A
Operating Temperature - Junction
-65°C~150°C
Output Current-Max
10A
Voltage - DC Reverse (Vr) (Max)
400V
Current - Average Rectified (Io)
10A
Number of Phases
1
Reverse Recovery Time
50ns
Rep Pk Reverse Voltage-Max
400V
Non-rep Pk Forward Current-Max
100A
Diode Configuration
1 Pair Common Cathode
RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant