Rochester Electronics, LLC FEP16FT

Mounting Type

Through Hole

Package / Case

TO-220-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Elements

2

Power Dissipation (Max)

8.33W

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Terminal Finish

MATTE TIN

Applications

GENERAL PURPOSE

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Terminal Position

SINGLE

Peak Reflow Temperature (Cel)

NOT APPLICABLE

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT APPLICABLE

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

10μA @ 300V

Voltage - Forward (Vf) (Max) @ If

1.3V @ 8A

Operating Temperature - Junction

-55°C~150°C

Output Current-Max

16A

Voltage - DC Reverse (Vr) (Max)

300V

Current - Average Rectified (Io)

16A

Number of Phases

1

Reverse Recovery Time

50ns

Rep Pk Reverse Voltage-Max

300V

JEDEC-95 Code

TO-220AB

Non-rep Pk Forward Current-Max

200A

Diode Configuration

1 Pair Common Cathode

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant