Rochester Electronics, LLC BUZ21

Mounting Type

Through Hole

Package / Case

TO-220-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Transistor Element Material

SILICON

Current - Continuous Drain (Id) @ 25℃

21A Tc

Number of Elements

1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

SIPMOS®

JESD-609 Code

e0

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Terminal Finish

TIN LEAD

Terminal Position

SINGLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

FET Type

N-Channel

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

85m Ω @ 13A, 10V

Vgs(th) (Max) @ Id

4V @ 1mA

Input Capacitance (Ciss) (Max) @ Vds

1.3pF @ 25V

Drain to Source Voltage (Vdss)

100V

JEDEC-95 Code

TO-220AB

Drain Current-Max (Abs) (ID)

19A

Drain-source On Resistance-Max

0.1Ohm

Pulsed Drain Current-Max (IDM)

75A

DS Breakdown Voltage-Min

100V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant