EP610DM-30

Rochester Electronics EP610DM-30

Part No:

EP610DM-30

Datasheet:

-

Package:

24-CDIP

AINNX NO:

37016129-EP610DM-30

Description:

MFR BY REI- ALTERA EPLD

Products specifications
  • Mounting Type
    Through Hole
  • Package / Case
    24-CDIP
  • Supplier Device Package
    24-CDIP
  • Core Material

    Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

    Ferrite
  • Product Depth (mm)
    Not Required(mm)
  • DC Resistance
    0.015(ohm)
  • Operating Temp Range
    -55C to 125C
  • Product Diameter (mm)
    15.88(mm)
  • Tolerance (+ or -)
    10%
  • Rad Hardened
    No
  • Number of I/Os
    22
  • Package
    Bulk
  • Number of Macrocells
    16
  • Mfr
    Rochester Electronics, LLC
  • Product Status
    Obsolete
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 125°C (TC)
  • Series
    -
  • Type
    Filter
  • Technology
    Wirewound
  • Military Standard
    Not Required
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    Not Required
  • Lead Spacing

    the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

    25.4(mm)
  • Programmable Type

    These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

    EPLD
  • Inductance
    10(uH)
  • Test Frequency

    a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

    0.001(MHz)
  • Impedance

    In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

    Not Required(ohm)
  • Lead Style
    Radial
  • DC Current
    12000(mA)
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    300
  • Voltage Supply - Internal
    4.5V ~ 5.5V
  • Delay Time tpd(1) Max
    30 ns
  • Product Length (mm)
    28.58(mm)
  • Product Height (mm)
    Not Required(mm)
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