Rochester Electronics 5962-8765501RA(NSC)

Lead Shape

Through Hole

Supplier Package

CDIP

Standard Package Name

DIP

PCB changed

20

Package Length

25.02(Max)

Package Width

7.87(Max)

Package Height

4.57(Max)

Mounting

Through Hole

Supplier Temperature Grade

Military

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Maximum Power Dissipation (mW)

500

Propagation Delay Test Condition (pF)

50

Maximum Quiescent Current (uA)

1500

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Minimum Operating Supply Voltage (V)

4.5

Maximum High Level Output Current (mA)

-12

Maximum Low Level Output Current (mA)

32

Input Signal Type

Single-Ended

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

12.5

Maximum Propagation Delay Time @ Maximum CL (ns)

[email protected] to 5.5V

Bus Hold

No

Number of Output Enables per Chip

2 Low

Number of Outputs per Chip

8

Number of Input Enables per Chip

0

Number of Inputs per Chip

8

Number of Channels per Chip

8

Number of Elements per Chip

2

Logic Family

FCT

PPAP

No

Automotive

No

HTS

8542.39.00.01

ECCN (US)

3A001a.2.c.

EU RoHS

Not Compliant

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

20

Output Type

3-State

Polarity

Inverting

Logic Function

Buffer/Line Driver