Rochester Electronics 5962-8763001RA(IDT)

EU RoHS

Not Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Logic Family

FCT

Number of Elements per Chip

2

Number of Channels per Chip

8

Number of Inputs per Chip

8

Number of Input Enables per Chip

0

Number of Outputs per Chip

8

Number of Output Enables per Chip

2 Low

Bus Hold

No

Maximum Propagation Delay Time @ Maximum CL (ns)

[email protected] to 5.5V

Absolute Propagation Delay Time (ns)

10.5

Process Technology

CMOS

Input Signal Type

Single-Ended

Maximum Low Level Output Current (mA)

48

Maximum High Level Output Current (mA)

-12

Minimum Operating Supply Voltage (V)

4.5

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.5

Maximum Quiescent Current (uA)

1500

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

Mounting

Through Hole

Package Height

4.57(Max)

Package Width

7.87(Max)

Package Length

25.02(Max)

PCB changed

20

Standard Package Name

DIP

Supplier Package

CDIP

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Rail

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

20

Output Type

3-State

Polarity

Non-Inverting

Logic Function

Buffer/Line Driver