RF Micro Devices Inc RF5601TR7

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

SURFACE MOUNT

Weight

0.2 kg

Number of Terminals

8

Rohs Code

Yes

Part Life Cycle Code

Transferred

Ihs Manufacturer

RF MICRO DEVICES INC

Package Description

LCC8,.08SQ,25

Operating Temperature-Max

75 °C

Operating Temperature-Min

-20 °C

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LCC8,.08SQ,25

Gross weight

215.00

Transport packaging size/quantity

29*25*35/50

Analog

POC40

Melting temperature

183...240 °C

Soldering temperature

285...330 °C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

coil

Pbfree Code

Yes

ECCN Code

5A991.G

Type

Soft Lead-Tin Solder Sn/Pb

Composition

lead - 40%; tin - 60%

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8517.70.00.00

Number of Functions

1

Construction

COMPONENT

Reach Compliance Code

compliant

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3.3 V

Gain

9 dB

RF/Microwave Device Type

NARROW BAND LOW POWER

Design

wire

Operating Frequency-Min

4900 MHz

Input Power-Max (CW)

5 dBm

Characteristic Impedance

50 Ω

Differential Nonlinearity

5850 MHz

Diameter

1.2 mm