RFFM3482ETR7SAM
16-XFQFN Exposed Pad
1874377-RFFM3482ETR7SAM
IC 2.4GHZ FRONT END MOD
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.