RC19104AGNL#BB0
28-VFQFN Exposed Pad
70156572-RC19104AGNL#BB0
GEN6 1V8 BUFFER 4 OUTPUT WITH SL
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.