Renesas Electronics Corporation R9A06G033SGBA#BC0

Mounting Type

Surface Mount

Package / Case

196-LFBGA

Supplier Device Package

196-LFBGA (12x12)

Series

RZ/N1S

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 110°C (TJ)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Speed

500MHz

Core Processor

ARM® Cortex®-A7

Voltage - I/O

3.3V

Ethernet

10/100/1000Mbps (5)

Number of Cores/Bus Width

1 Core, 32-Bit

Graphics Acceleration

Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

Yes

RAM Controllers

DDR2, DDR3

USB

USB 2.0 (2)

Additional Interfaces

CANbus, I2C, SPI, UART

Co-Processors/DSP

ARM® Cortex®-M3

Security Features

Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

Secure JTAG

Display & Interface Controllers

A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.

LCD