R8J66607B00FP#RF1S

Renesas Electronics Corporation R8J66607B00FP#RF1S

Part No:

R8J66607B00FP#RF1S

Datasheet:

-

Package:

-

AINNX NO:

69031770-R8J66607B00FP#RF1S

Description:

SOC/SIP

Products specifications
  • Series
    *
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
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