Renesas Electronics Corporation R7FA6M5BH3CFP#BA0

Mounting Type

Surface Mount

Package / Case

100-LQFP

Supplier Device Package

100-LFQFP (14x14)

Mfr

Renesas Electronics Corporation

Number of I/Os

75

Data Converters

A/D 20x12b SAR; D/A 2x12b

Base Product Number

R7FA6M5BH3

Series

RA6M5

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 105°C (TA)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

Speed

200MHz

RAM Size

512K x 8

Voltage - Supply (Vcc/Vdd)

2.7V ~ 3.6V

Core Processor

ARM? Cortex?-M33

Peripherals

Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

2MB (2M x 8)

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB

EEPROM Size

8K x 8