Renesas Electronics America Inc. LDS7001NTGI8

Mounting Type

Surface Mount

Package / Case

48-WFQFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Voltage - Supply

2.7V~3.6V

Base Part Number

IDTLDS7001

Interface

I2C, SPI

Resolution (Bits)

10 b

Touchscreen

2 Wire Capacitive

Voltage Reference

Internal