Renesas Electronics America Inc. HFA1105IBZ

Factory Lead Time

8 Weeks

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154, 3.90mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

8

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn) - annealed

Applications

Current Feedback

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Number of Functions

1

Base Part Number

HFA1105

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDSO-G8

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Number of Circuits

1

Output Current

The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

60mA

Current - Supply

5.8mA

Slew Rate

the maximum rate of output voltage change per unit time.

1000V/μs

Amplifier Type

OPERATIONAL AMPLIFIER

Voltage - Supply, Single/Dual (±)

±4.5V~5.5V

-3db Bandwidth

330MHz

Length

4.9mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant