GX62476B-HIU

Renesas Electronics America Inc GX62476B-HIU

Part No:

GX62476B-HIU

Datasheet:

-

Package:

Module

AINNX NO:

28189772-GX62476B-HIU

Description:

MODULE REQUIRES WAFER

Products specifications
  • Package / Case
    Module
  • Supplier Device Package
    Module
  • Mfr
    Renesas Electronics America Inc
  • Package
    Tray
  • Product Status
    Active
  • Base Product Number
    GX62476
  • Moisture Sensitive
    Yes
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Minimum Operating Temperature
    - 5 C
  • Modulation Format
    DP-QPSK
  • Factory Pack QuantityFactory Pack Quantity
    50
  • Mounting Styles
    SMD/SMT
  • Manufacturer
    Renesas Electronics
  • Brand
    Renesas Electronics
  • Series
    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Type
    Modulator
  • Subcategory
    Wireless & RF Integrated Circuits
  • Technology
    Si
  • Frequency
    -
  • Function
    Driver
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Modulator / Demodulator
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    General Purpose
  • Secondary Attributes
    -
  • Product Category

    a particular group of related products.

    Modulator / Demodulator
  • Width
    0 mm
  • Height
    0 mm
  • Length
    0 mm
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