Renesas ISL26315FVZ

Mounting Type

Surface Mount

Package / Case

100-BQFP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

100-QFP (14x20)

Number of Terminals

16

Number of I/Os

84

Package

Bulk

Base Product Number

MB90678

Mfr

Infineon Technologies

Data Converters

A/D 8x8/10b

Product Status

Obsolete

Package Description

TSSOP, TSOP16,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSOP16,.25

Manufacturer Package Code

M16.17316

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

125 °C

Manufacturer Part Number

ISL26315FVZ

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

Active

Samacsys Description

SAR A/D Converters 12-bit, 125kSPS Low-power ADCs with Single-ended and Differential Inputs and Multiple Input Channels

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.71

Part Package Code

TSSOP

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Series

F²MC-16LX MB90675

JESD-609 Code

e3

Terminal Finish

Matte Tin (Sn)

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.65 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

16

JESD-30 Code

R-PDSO-G16

Brand Name

Renesas

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

AUTOMOTIVE

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

External

Speed

16MHz

RAM Size

3K x 8

Voltage - Supply (Vcc/Vdd)

2.7V ~ 5.5V

Number of Bits

12

Core Processor

F²MC-16L

Peripherals

POR, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Mask ROM

Core Size

16-Bit

Program Memory Size

64KB (64K x 8)

Connectivity

EBI/EMI, I²C, SCI, UART/USART

Supply Current-Max

3 mA

Converter Type

ADC, SUCCESSIVE APPROXIMATION

Seated Height-Max

1.2 mm

Data Interface

A Data Interface in EDQ is a template of a set of attributes representing a given entity, used to create processes that read from, or write to, interfaces rather than directly from or to sources or targets of data.

SPI

EEPROM Size

-

Number of Analog In Channels

4

Sampling Rate (Per Second)

125k

Output Bit Code

OFFSET BINARY

Linearity Error-Max (EL)

0.017089%

Number of A/D Converters

1

Analog Input Voltage-Max

5.25 V

Output Format

Output formats are used to determine which data is exported and how data is displayed in many areas of OLIB.

SERIAL

Width

4.4 mm

Length

5 mm