Renesas HIP2211FBZ-T

Package / Case

SOIC-8

Product Style

BGA Socketing Systems

Unit Weight

0.002540 oz

Factory Pack QuantityFactory Pack Quantity

2500

Mounting Styles

SMD/SMT

Manufacturer

Renesas Electronics

Brand

Renesas / Intersil

RoHS

Details

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Type

Socket Adapter Systems

Subcategory

PMIC - Power Management ICs

Pitch

1.27mm Pitch

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Socket Adapter Systems

Product Category

a particular group of related products.

Gate Drivers