RAF S-1345

Lifecycle Status

Production (Last Updated: 2 days ago)

Mount

Surface Mount

Weight

2.012816 mg

Voltage, Rating

50 V

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Tolerance

1 %

Number of Terminations

2

Termination

Solder

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

50 ppm/°C

Resistance

28.7 Ω

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

155 °C

Min Operating Temperature

-55 °C

Composition

Thin Film

Power Rating

63 mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

63 mW

Case Code (Metric)

1608

Case Code (Imperial)

0603

Number of Resistors

1

Wire/Cable Diameter

1 mm

Outside Diameter

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

19.05 mm

Width

787.4 µm

Height

450 µm

Length

1.5494 mm

REACH SVHC

Unknown