Qualcomm GSD4E-9411-TR

Factory Lead Time

11 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

103-TFBGA

Number of Pins

103

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Applications

GPS

Voltage - Supply

1.2V 1.8V

Interface

I2C, SPI, UART

Core Processor

ARM7®

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROM

Core Architecture

ARM

Controller Series

SiRFstarIV™

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free