BC57E687C-GITB-E4

Qualcomm BC57E687C-GITB-E4

Part No:

BC57E687C-GITB-E4

Manufacturer:

Qualcomm

Package:

169-TFBGA

ROHS:

AINNX NO:

1679966-BC57E687C-GITB-E4

Description:

IC RF TXRX+MCU BLUTOOTH 169TFBGA

Products specifications
  • Package / Case
    169-TFBGA
  • Number of Pins
    169
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    BlueCore5™ Multimedia
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Type
    TxRx + MCU
  • Voltage - Supply
    1.5V
  • Frequency
    2.4GHz
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    48kB RAM
  • Protocol
    Bluetooth v2.1 +EDR, Class 2 and 3
  • Power - Output
    8dBm
  • RF Family/Standard
    Bluetooth
  • Sensitivity
    -90dBm
  • Data Rate (Max)
    3Mbps
  • Serial Interfaces

    A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.

    I2C, I2S, UART, USB
  • GPIO
    16
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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