Qualcomm B39321R822H210

Mount

Through Hole

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

SURFACE MOUNT

Number of Pins

2

RoHS

Non-Compliant

Package Description

ROHS COMPLIANT, QCC4A, SMD, 4 PIN

Operating Temperature-Min

-45 °C

Operating Frequency-Nom

319.508 MHz

Operating Temperature-Max

125 °C

Manufacturer Part Number

B39321R822H210

Manufacturer

TDK Epcos

Part Life Cycle Code

Active

Ihs Manufacturer

EPCOS AG

Risk Rank

5.6

Manufacturer Series

R822

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel

Tolerance

10 %

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-65 °C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1.5 W

Reach Compliance Code

unknown

Physical Dimension

L5.0XB3.5XH1.45 (mm)/L0.197XB0.138XH0.057 (inch)

Impedance

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

6 Ω

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Max Reverse Leakage Current

5 µA

Zener Voltage

4.3 V

Crystal/Resonator Type

1-PORT

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

1.9 dB

Parallel Capacitance

2.7 pF

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

Yes