Pulse Electronics Power ST3-12B5

Factory Lead Time

10 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Number of Pins

6

Weight

0.25lb 113.4g

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Split Bobbin Plug-In

Published

2009

Size / Dimension

35.05mm Lx28.70mm W

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

PC Pin

ECCN Code

EAR99

Type

Laminated Core

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

PARALLEL CONNECTED; HIGH ISOLATION

Power Rating

2.4W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

2.4W

Depth

28.7mm

Termination Style

PC Pin

Approval Agency

UL; CSA

Physical Dimension

L35.05XB28.7XH30.23 (mm)

Voltage - Isolation

2500Vrms

Max Output Current

The maximum current that can be supplied to the load.

200mA

Power - Max

2.4VA

Lead/Base Style

PC Pin

Voltage - Primary

115V

Primary Winding(s)

Single

Center Tap

In electronics, a center tap (CT) is a contact made to a point halfway along a winding of a transformer or inductor, or along the element of a resistor or a potentiometer.

No

Voltage - Secondary (Full Load)

Parallel 6.3V Series 12.6V

Secondary Winding(s)

Dual

VA Rating

2.4 VA

Height

30.23mm

Length

35.05mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant