PROTEK DEVICES VS10P08C-LF

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.10.00.80

Automotive

No

PPAP

No

Direction Type

Bi-Directional

Number of Elements per Chip

8

Maximum Working Voltage (V)

8

Minimum Breakdown Voltage (V)

8.5

Maximum Clamping Voltage (V)

16.6

Maximum Peak Pulse Current (A)

40

Maximum Leakage Current (uA)

10

Test Current (mA)

1

Peak Pulse Power Dissipation (W)

800

Capacitance Value (pF)

100

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Through Hole

Package Height

6.45(Max)

Package Width

3.4(Max)

Package Length

26.01(Max)

PCB changed

10

Supplier Package

VSIP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Diode Array

Pin Count

a count of all of the component leads (or pins)

10

Configuration

Octal