Preci-Dip 150-10-640-00-018101

Factory Lead Time

10 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Housing Material

POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER

Contact Materials

BRASS

Insulation Materials

Polyamide

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

150

Published

2011

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Connector Type

DIP, DIL - Header

Color

Black

Number of Rows

2

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

STANDARD: UL 94V-0

Contact Type

Male Pin

Pitch

0.100 2.54mm

Orientation

Straight

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

1A

Contact Finish

Gold

Number of Contacts

40

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

0.600 (15.24mm)

Number of Poles

40

Device Socket Type

IC SOCKET

Length

50.6mm

Width

17.7mm

Contact Finish Thickness

10.0μin 0.25μm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant