Power Dynamics PD-HEC-MSC-26

Mounting Type

AWG / mm²: 26 - 22 / 0.14 - 0.34

Manufacturer

GE - General Electric

RoHS

Y

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Material: CuZn, Silver plated

Size / Dimension

0.98 L x 0.12 W (25mm L x 3.3mm W)