Power Dynamics PD-HEC-FSC-18

Mounting Type

AWG / mm²: 18 / 0.75 - 1.0

Manufacturer

POWER DYNAMICS

RoHS

Y

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Material: CuZn, Silver plated

Size / Dimension

0.85 L x 0.12 W (21.6mm L x 3.3mm W)